发明名称 |
LOW DISTORTION SILANE-MODIFIED OLEFINIC RESIN MOLDING AND LOW SHRINK SILANE-CROSSLINKED OLEFINIC RESIN MOLDING AS WELL AS MANUFACTURING METHOD FOR THESE, AND HOT WATER RUNWAY TYPE HEATING RADIATOR PANEL MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a silane-crosslinked olefinic resin molding which has the low moisture content and the recyclability for the product. SOLUTION: The low distortion silane-modified olefinic resin molding has a shrink ratio, by a hot water treating test as the following, of less than 1%, and a gel fraction of less than 50%, and this molding is manufactured by heat treating a silane-modified olefinic resin molding under a dry atmosphere with a humidity of 80% or less. The low shrink silane-crosslinked olefinic resin molding is formed by crosslinking reaction of this low distortion silane-modified olefinic resin molding in the presence of water. The hot water runway type heating radiator panel material uses this low distortion silane-modified olefinic resin molding and this low shrink silane-crosslinked olefinic resin molding. The above hot water treating test comprises the hot water treatment for the above molding to be kept in a hot water of 80°C and for 8 hours, and thereafter the measuring of the dimensions of the molding respectively before and after the hot water treatment test and finally the determining of a shrink ratio(%) of a dimension L<SB>x</SB>after the hot water treatment to a dimension L<SB>o</SB>before the hot water treatment, by using the formula: a shrink ratio(%)=(L<SB>o</SB>-L<SB>x</SB>)/L<SB>o</SB>×100. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006117836(A) |
申请公布日期 |
2006.05.11 |
申请号 |
JP20040308354 |
申请日期 |
2004.10.22 |
申请人 |
MITSUBISHI KAGAKU SANSHI CORP |
发明人 |
SEKI HITOSHI;NAGASE SADAO;UENO KOICHI |
分类号 |
C08J5/00;C08L23/26;F16L9/12;F24D3/16 |
主分类号 |
C08J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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