发明名称 TREATMENT METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a treatment method which does not raise problems concerning etching selection, in executing a removal treatment by wet etching on at least two layers of laminated films present in an object to be treated, and enables removal of the two layers by etching at a sufficiently high speed. SOLUTION: The removal treatment by wet etching is executed on at least two layers of the laminated films that consists of a first film and a second film present in the object to be treated. The removal treatment includes a step (step 2) of etching the first film, by bringing a first treating liquid in contact with the first film of the object, a step (step 3) deciding whether the first film is removed, a step (step 4) of replacing the first treating liquid with the second treating liquid that is different in condition from the first treating liquid, when it is decided that the first film to be removed, and a step (step 5) of etching the second film by bringing the second treating liquid in contact with the second film. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006120708(A) 申请公布日期 2006.05.11
申请号 JP20040304471 申请日期 2004.10.19
申请人 TOKYO ELECTRON LTD 发明人 GREN GALE
分类号 H01L21/306 主分类号 H01L21/306
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