CAPACITOR LAYER FORMING MATERIAL, AND PRINTED WIRING BOARD HAVING INTERNAL CAPACITOR LAYER OBTAINED BY USING SUCH CAPACITOR LAYER FORMING MATERIAL

摘要

A capacitor layer forming material applicable to a printed wiring board produced through a high temperature processing process of a fluororesin substrate, a liquid crystal polymer or the like at 300-400°C without causing deterioration in strength after high temperature heating. The capacitor layer forming material for a printed wiring board having a dielectric layer interposed between a first conductive layer which is used for forming an upper electrode and a second conductive layer which is used for forming a lower electrode is characterized in that the second conductive layer is a nickel layer or a nickel alloy layer. Preferably, the nickel layer or nickel alloy layer as the second conductive layer has a thickness of 10-100 µm. Furthermore, the dielectric layer is composed of such a material which is suitable for formation on the nickel layer or nickel alloy layer as the second conductive layer by sol-gel method.