| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power supply device for a vehicle which can stress the complication of an underfloor structure even when the power supply device is provided with two power converters, and can enhance the mounting density of semiconductor devices. <P>SOLUTION: The power supply device for a vehicle is provided with a heat receiving block 21 wherein one-phase amount of semiconductor devices 1A of one power converter is mounted to a first component fitting surface, and one-phase amount of semiconductor elements 1B of the other converter is mounted to a second component fitting surface; a straight heat pipe with its base end bonded like projection from the third component fitting surface of the heat receiving block 21; three heat transfer stacks 12A wherein the heat receiving block, the straight heat pipe, and a heat radiating fin fitted with the straight heat pipe, are integrally assembled; and a flame wherein one heat transfer stack is arranged at center, one of the remaining heat transfer stacks is made to face at a specified interval with respect to the center heat transfer stack in each first component fitting surface, and the other remaining heat transfer stack is made to face at a specified interval with respect to the center heat transfer stack in each second component fitting surface. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
