| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip built-in substrate building a semiconductor chip into a resin substrate which can be thinned and can mount other chip built-in substrate and connect it to a substrate (for example, a mother board), and to provide its manufacturing method. <P>SOLUTION: The chip built-in substrate has the semiconductor chip 33 built-in with a resin base material 31 containing a spherical filler of 60-90 wt.% for the whole resin base material 31 into the resin, which is composed of a through via 44 passing through the resin base material 31. A first external connection terminal 53 is formed on the upper surface 31a of the resin base material 31 and electrically connected with the through via 44. A second external connection terminal 54 is formed on the lower surface 31b of the resin base material 31 and electrically connected with the through via 44. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
