| 摘要 |
PROBLEM TO BE SOLVED: To improve communication among integrated circuit chips jointed through capacitive coupling. SOLUTION: A system provided operates by covering capacitive transmission pads (202 and 204) on a first integrated circuit chip to place an interposer (210) and by producing the interposer (210) from an anisotropic material (212) for a transmission of a capacitive signal. A second IC chip is provided so that communication pads (206 and 208) on the second IC chip match the capacitive coupling signals among IC chips going through the intermediary of the interposer. An increase in the dielectric constant, caused by the interposer, can improve the capacitive coupling between the mutually facing transmission pads on the IC chips. The interposer can also decrease crosstalks between a communication pad on the first IC chip and a pad adjacent to a facing communication pad on the second IC. COPYRIGHT: (C)2006,JPO&NCIPI
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