发明名称 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND PROGRAM
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which is capable of enhancing productivity in manufacturing product substrates. SOLUTION: An etching apparatus 100 as the substrate processing apparatus is provided with a rotary arm 103 for carrying a substrate included in a lot, and process chambers 106 and 107 for carrying out etching to the substrate as product processing. The etching apparatus 100 is controlled by a host computer 200 in which a transportation recipe, a recipe for product processing and a recipe for dummy processing are registered. When a chamber neglecting time being each neglecting time of the process chambers 106 and 107 does not become time out, the host computer 200 discriminates that processing atmosphere in the process chambers used for etching to the lot is stable, omits the execution of the dummy processing, and executes etching to the substrate of the lot. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006121030(A) 申请公布日期 2006.05.11
申请号 JP20050047362 申请日期 2005.02.23
申请人 TOKYO ELECTRON LTD 发明人 YAMAZAKI SATOSHI;HASHIMOTO MITSURU
分类号 H01L21/02;H01L21/3065 主分类号 H01L21/02
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