发明名称 WIRING STRUCTURE USING MULTILAYERED CARBON NANOTUBE FOR INTERLAYER WIRING, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a wiring structure capable of turning into low resistance, where a multilayered carbon nanotube (CNT) is used for interlayer wiring of two or more conductive layers. SOLUTION: In the wiring structure, the multilayered CNT is used for the interlayer wiring of two or more conductive layers. A plurality of annular cut areas formed in concentric circular states by a graphene sheet contained in the multilayered CNT at the end of the CNT on the side far from the growing base point of the CNT is respectively brought into contact with the conductive layers. Since the conductive layers and graphene sheet are brought into contact with each other, without going through the intermediary of the portion of the cap layer of the CNT, the contact resistances between the conductive layers and graphene sheet become smaller than those of the conventional types. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006120730(A) 申请公布日期 2006.05.11
申请号 JP20040304667 申请日期 2004.10.19
申请人 FUJITSU LTD 发明人 KONDO DAIYU;NIHEI MIZUHISA
分类号 H01L21/3205;H01L21/768;H01L23/52 主分类号 H01L21/3205
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