发明名称 Deposition method and apparatus
摘要 A deposition method and apparatus provide a uniform deposition rate and good reproducibility in a process used to deposit a material onto a substrate. The deposition method includes preparing a substrate on which a thin film is deposited, preparing a line source that includes a plurality of heating crucibles are disposed in line, and rotating the line source while depositing the deposition material on the substrate.
申请公布号 US2006099820(A1) 申请公布日期 2006.05.11
申请号 US20050266398 申请日期 2005.11.04
申请人 SAMSUNG SDI CO., LTD. 发明人 RYU SEOUNG-YOON
分类号 H01L21/31;C23C16/00;H01L21/469 主分类号 H01L21/31
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