发明名称 Temperature measurement and heat-treating methods
摘要 Temperature measurement and heat-treating methods and systems. One method includes identifying a temperature of a first surface of a workpiece, and controlling energy of an irradiance flash incident on the first surface of the workpiece, in response to the temperature of the first surface. Identifying may include identifying the temperature of the first surface during an initial portion of the irradiance flash, and controlling may include controlling the power of a remaining portion of the irradiance flash. The first surface of the workpiece may include a device side of a semiconductor wafer.
申请公布号 US2006096677(A1) 申请公布日期 2006.05.11
申请号 US20050302600 申请日期 2005.12.14
申请人 CAMM DAVID M;KERVIN SHAWNA;LEFRANCOIS MARCEL E;STUART GREG 发明人 CAMM DAVID M.;KERVIN SHAWNA;LEFRANCOIS MARCEL E.;STUART GREG
分类号 C21D1/09;G01J5/00;G01J5/10;G01J5/48;H01L21/00 主分类号 C21D1/09
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