COPPER POWDER FOR ELECTRONIC MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a copper powder having a high sintering-starting temperature suitable for a ceramic substrate for a simultaneously-baked type copper circuit. SOLUTION: The copper powder is surface-coated with a nitrogen-containing heterocyclic compound or a water-soluble polymer having the sintering-starting temperature of 700°C or higher, which has been baked in an inert atmosphere or a reducing atmosphere at a heating rate of 10°C/min or higher. COPYRIGHT: (C)2006,JPO&NCIPI