发明名称 INSPECTION DEVICE FOR SEMICONDUCTOR INTEGRATED CIRCUIT AND MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To easily bring a semiconductor integrated circuit (LSI hereafter) located in a deep site distant from a connector electrode of a substrate into a test mode so as to be easily inspected, when inspecting the mounting substrate mounted with the plurality of LSIs. SOLUTION: This inspection device is provided with a noncontact type IC comprising an antenna, an RF circuit, a nonvolatile memory and a control circuit, on a substrate to be inspected, an output from the IC is connected to the each LSI mounted on the substrate, information of the memory is rewritten from an outside by a reading/writing device for the noncontact type IC, and a signal is output to switch each LSI to the test mode. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006118873(A) 申请公布日期 2006.05.11
申请号 JP20040304147 申请日期 2004.10.19
申请人 CANON INC 发明人 TAKAHASHI KAZUYA
分类号 G01R31/28 主分类号 G01R31/28
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