| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an excellent photosensitive resin composition and photosensitive dry film resist capable of undergoing water-based development, ensuring a good pattern shape and providing a film having excellent moisture and heat resistances after curing, and to provide usage of these. <P>SOLUTION: The photosensitive resin composition contains (A) a soluble polyimide having a carboxyl group and/or a hydroxyl group and (B) a (meth)acrylic compound, wherein the soluble polyimide (A) is a soluble polyimide prepared using diphenylsulfone-3,4,3',4'-tetracarboxylic acid dianhydride as a part of raw materials. The photosensitive dry film resist is produced from the photosensitive resin composition. A printed wiring board using the photosensitive dry film resist as an insulating protective layer is also provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
