摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact apparatus for attaching electronic components that can reduce the attachment time of electronic components and has improved productivity. <P>SOLUTION: The attaching apparatus of electronic components comprises a plurality of heads H, capable of moving to a prescribed position; a head holder 20 for holding the heads H; and an insulating substrate 4 to which electronic components 8 are attached. One head or a plurality of heads in the plurality of heads H are formed by a bulk head 31. The bulk head 31 has a storage section 34a for storing a number of chip electronic components 8, an aligning hole S that is connected to the storage section 34a and aligns the electronic components 8 in a row, and an exhausting port G that is connected to the aligning hole S and discharges the electronic components 8, one by one for attaching the electronic components 8 discharged from the exhausting port G to the insulating substrate 4. Thus, the bulk head 31 can reduce the quantity of motion, when attaching the electronic components 8, can reduce attachment time, and can improve productivity. <P>COPYRIGHT: (C)2006,JPO&NCIPI |