发明名称 Passive device structure
摘要 A method including forming a ceramic material directly on a sheet of a first conductive material; forming a second conductive material on the ceramic material; and sintering the ceramic material. A method including forming a ceramic material directly on a sheet of a first conductive material; forming a second conductive material on the ceramic material so that the ceramic material is disposed between the first conductive material and the second conductive material; thermal processing at a temperature sufficient to sinter the ceramic material and form a film of the second conductive material; and coating an exposed surface of at least one of the first conduct material and the second conductive material with a different conductive material. An apparatus including first and second electrodes; and a ceramic material between the first electrode and the second electrode, wherein the ceramic material is sintered directly on one of the first and second electrode.
申请公布号 US2006097246(A1) 申请公布日期 2006.05.11
申请号 US20040971829 申请日期 2004.10.21
申请人 PALANDUZ CENGIZ A;MIN YONGKI 发明人 PALANDUZ CENGIZ A.;MIN YONGKI
分类号 H01L29/08;H05K3/10 主分类号 H01L29/08
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