发明名称 |
Injection molded metal bonding tray for integrated circuit device fabrication |
摘要 |
An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is placed on the substrate and the conductors are bonded to the substrate in an infrared reflow oven, for example. Other embodiments are described and claimed.
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申请公布号 |
US2006099788(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
US20040984042 |
申请日期 |
2004.11.08 |
申请人 |
DAVISON PETER A;HOULE SABINA J |
发明人 |
DAVISON PETER A.;HOULE SABINA J. |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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