Abdeckstreifen zum Transport von Chips und abgedichtete Struktur

摘要

A cover tape for chip transportation stuck to a surface of a carrier tape which has parts for accommodating chips formed intermittently in its lengthwise direction, to thereby seal the chip accommodating parts, wherein said cover tape comprises a tape-shaped substrate and pressure sensitive adhesive parts superimposed on one side of the tape-shaped substrate so that the pressure sensitive adhesive parts do not face the chip accommodating parts, the above pressure sensitive adhesive parts comprising a silicone pressure sensitive adhesive and a crosslinking agent (C) capable of crosslinking therewith, the above silicone pressure sensitive adhesive comprising: (A) a silicone resin component and (B) a silicone rubber component which contains a phenyl group. This cover tape for chip transportation enables avoiding a lifting/separation of cover tape from carrier tape caused by a difference in thermal shrinkage ratio when a polystyrene carrier tape is used and also enables avoiding an adhesive residue occurring on carrier tape when a carrier tape with relatively high polarity, such as polycarbonate, polyvinyl chloride or amorphous polyethylene terephthalate tape is used.