| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive laminated film which is equipped with heat-resistance, high frequency corresponding property, and flexibility at a high level, and also, can achieve the reliability and the reduction (thinning) of insulation by using a polyimide having a thickness of a specified value or lower as the insulating layer. SOLUTION: For this adhesive laminated film, an adhesive layer of which the thickness is 5μm or lower is formed at least on one surface of a high polymer film of which the modulus of tensile elasticity is 6 GPa or higher, the glass transition temperature is 150°C or higher, and the thickness is 1 to 10μm. Preferably, the polymer film is a polyimide benzooxazole film in the adhesive laminated film. COPYRIGHT: (C)2006,JPO&NCIPI |
