PASTE FOR SOLDERING AND SOLDERING METHOD USING THE SAME

摘要

A flux having a metal powder incorporated therein which is used between a bump and a circuit electrode in the mounting of electronic parts by soldering, wherein the metal powder comprises a core metal formed with a metal such as tin or zinc and a surface metal containing gold, silver or the like covering the surface of the core metal. A soldering method using the above flux is free from the retention after reflow of a metal powder as a residue in a state where the metal powder is prone to migrate, and thus can combine good soldering characteristics and good electric insulation.