METHOD OF SINGULATING ELECTRONIC DEVICES

摘要

A method of singulating electronic devices, including aligning a saw blade (215, 415, 515) over a lid street (244, 344, 544, 744) disposed on a lid substrate (240, 340, 440, 540, 740, 840) that is disposed over a device substrate (120, 220, 320, 420, 520, 620, 620, 820). The device substrate includes an electronic device (122a, 122b, 122c, 122d, 222, 222') disposed thereon, and the electronic device includes a bond pad (224, 224', 324, 324', 424, 424', 524, 524' 624, 824, 824') disposed on the device substrate, wherein the lid street is disposed over the bond pad. In addition, the method also includes sawing partially through the lid street to form a trench (246, 346) in the lid street. The trench includes a trench bottom (248, 348) disposed in the lid substrate.