| 摘要 |
<P>PROBLEM TO BE SOLVED: To effectively transmit supersonic vibration to an electronic component to be mounted without bringing the holding surface of a holding tool into contact with a mounted electronic component, and to accurately obtain the position of the electronic component held by the holding tool in an electronic component mounting deice for mounting an electronic component on a circuit board at high density by using supersonic vibration. <P>SOLUTION: The electronic component mounting device mounts an electronic component 91 on a circuit board, by pressing the electronic component 91 to the circuit board, while applying supersonic vibration to the electronic component 91 via the holding toll holding the holding surface 353 of the holding tool. The holding surface 353 is formed to a chamfered square. Consequently, it is possible to prevent to falsely detect the corner of the holding surface 353 as the corner of the electronic component when an image of the electronic component is obtained, while keeping the rigidity of a tip part of the holding tool high and to accurately obtain the position of the electronic component. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
