| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow-soldering method for a large electronic component capable of reflow-soldering electronic components largely different in heat capacity to each other at a time. SOLUTION: The reflow-soldering method for a large electronic component includes steps of heating by heaters which have passed through a reflow furnace and been located vertically, and simultaneously soldering a plurality of large and small electronic components different in heat capacity mounted on a printed board 10 for surface-packaging. A heat conductive member 12 is embedded in a through hole 11 formed corresponding to a solder 5 connecting the lead terminal 4 of the mounted large electronic component 1 on the printed board 10, and a heat sink 6 is mounted on the rear face of the printed board 10 along the lead terminal 4 when feeding into the reflow furnace. COPYRIGHT: (C)2006,JPO&NCIPI |
