发明名称 MANUFACTURING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing method of an electronic component capable of effectively and inexpensively forming a fine pitch conductor pattern. SOLUTION: The manufacturing method of an electronic component comprises a first process (a) of disposing a coated film 160 on a substrate 120; a second process (b) of providing an opening 160a by partially removing the coated film 160; a third process (c) of filling the opening 160a with a fluid material 172 containing conductive fine particles, by applying the fluid material on the coated film 160 and the opening 160a; a fourth process (d) of forming a conductor 174 by hardening the fluid material 172; and a fifth process (e) of removing the coated film 160 from the substrate 120. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006120888(A) 申请公布日期 2006.05.11
申请号 JP20040307750 申请日期 2004.10.22
申请人 SEIKO EPSON CORP 发明人 KURASAWA MUNENORI
分类号 H05K3/10;G09F9/00;H05K3/00;H05K3/12;H05K3/38 主分类号 H05K3/10
代理机构 代理人
主权项
地址