| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of electronic parts using stainless steel with a plated film, by subjecting the stainless steel of a metallic material used in the electronic parts to surface treatment which imparts high corrosion-resistance and high solderability. SOLUTION: This stainless steel with plated film is produced by the steps of: forming a strike-plated layer of nickel 12 with film thickness as extremely thin as 0.01 to 0.05μm, on the surface of a stainless steel substrate 11; and sequentially forming a thin palladium layer 13 (with film thickness of 50μm or thicker) and a gold layer 14 (with film thickness of 20μm or thicker) on the strike-plated layer of nickel 12 of the underlayer. The stainless steel with the film plated into the above structure has the film which is formed in a simple surface treatment process, has reliable adhesiveness, and is superior in both of corrosion resistance and solder wettability. COPYRIGHT: (C)2006,JPO&NCIPI
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