Stepped integrated circuit packaging and mounting

摘要

An electronic assembly and system and method implementing the same are disclosed herein. The electronic assembly includes an IC carrier package having circuitry contained within a housing unit. The IC carrier package includes a connector interface for electrically coupling the IC carrier package circuitry to a printed circuit board. The connector interface is further characterized as having a graduated step surface contour with one or more electrical contacts disposed on at least two graduated step connector surfaces of the connector interface. The electronic assembly further includes a multilayer printed circuit board having a mounting site cavity for mounting the IC carrier package. The mounting site cavity includes having at least two seating surfaces offset in a graduated step manner for receivably seating the at least two graduated step connector surfaces of the IC carrier package connector interface.