发明名称 |
Light emitting diode component |
摘要 |
In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board. |
申请公布号 |
US2006097245(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
US20050312268 |
申请日期 |
2005.12.20 |
申请人 |
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发明人 |
AANEGOLA SRINATH K.;RADKOV EMIL V.;REGINELLI JAMES;STADELMAN LARRY R.;MRAKOVICH MATTHEW;STIMAC TOMISLAV J. |
分类号 |
F21K99/00;H01L23/02;H01L29/06;H01L31/0328;H01L31/0336;H01L31/072;H01L31/109 |
主分类号 |
F21K99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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