发明名称 |
COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING |
摘要 |
<p>Improved compositions and processes for removing photoresists, polymers, post etch residues, and post oxygen ashing residues from interconnect, wafer level packaging, and printed circuit board substrates are disclosed. One process comprises contacting such substrates with mixtures containing an effective amount of organic ammonium compound(s); from about 2 to about 20 weight percent of oxammonium compound(s); optionally organic solvent(s); and water.</p> |
申请公布号 |
WO2006050323(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
WO2005US39381 |
申请日期 |
2005.10.28 |
申请人 |
EKC TECHNOLOGY, INC.;LEE, WAI, MUN |
发明人 |
LEE, WAI, MUN |
分类号 |
H01L21/3213;C11D7/32;C11D11/00 |
主分类号 |
H01L21/3213 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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