| 摘要 |
PROBLEM TO BE SOLVED: To provide a jetting type soldering apparatus having extremely high reliability without arranging a movable part in a solder. SOLUTION: This jetting type soldering apparatus is provided with; a storing vessel 18 capable of controlling the pressure in the space in contact with liquid surface when the solder is stored; a recovering vessel 19 opened to the atmosphere at the upper end part; a solder return-back tube 29 opened at the upper end part by standing up in the storing vessel 18 and communicated with the recovering vessel 19 at the lower end part by penetrating the storing vessel 18; and a solder feeding tube 26 opened at the upper end part by standing up in the recovering vessel 19 and communicated with the storing vessel 18 at the lower position than the upper part of the solder return-back tube 29 at the lower end part and penetrating the recovering vessel 19; and if necessary, a fluid pressing machine etc., is connected with the storing vessel 18. COPYRIGHT: (C)2006,JPO&NCIPI
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