| 摘要 |
<p>A wafer (W) is cleaned in a treating container (10) filled with a treatment liquid while being held by a wafer holding body (30) and rotated. A rotating shaft (21) connected to the wafer holding body (30) is stored in a shaft housing (22). A first seal structure (24) and variable type second seal structure (26) are provided for sealing a space between the shaft housing (22) and the rotating shaft (21). While liquid treatment is being performed to the wafer (W) in the treating container (10), the second seal structure (26) is in an unsealing status. At the time of performing drying treatment to the wafer (W) in the treating container (10), the second seal structure (26) is permitted to be in a sealing status, and an intermediate space (26d) between the first seal structure (24) and the second seal structure (26) is cleaned and dried. At the time of performing the subsequent liquid treatment, the treatment liquid is not contaminated by a residual material in the intermediate space (26d).</p> |
