发明名称 |
COATING LIQUID FOR FORMING SILICA BASED FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a coating liquid for forming a silica based film which has a low dielectric constant and can form a silica based film which is hard to reduce film thickness by peeling liquid or to raise a dielectric constant. SOLUTION: The coating liquid for forming the silica based film contains (A) a reaction product made to perform a hydrolysis reaction of the alkyltrialkoxysilane, and (B) one type or more selected from a group consisting of a polyalkyleneglycol and its end alkylate. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006120919(A) |
申请公布日期 |
2006.05.11 |
申请号 |
JP20040308221 |
申请日期 |
2004.10.22 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
IIDA HIROYUKI;SATO ISAO;TAKAHAMA AKIRA |
分类号 |
H01L21/316;C08K5/19;C08L71/02;C08L83/04;C09D1/00;C09D171/02;C09D183/04;H01L21/312 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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