| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, which can be suitably used for preparation of a circuit board and is excellent in adhesiveness and processability and further excellent in heat resistance, resin flowability and dielectric characteristics in the GHz band region, and also to provide a typical application technique of the same. SOLUTION: The thermosetting resin composition contains: (A) a polyimide resin component; (B) an amine component; (C) an epoxy resin component; and (D) an imidazole component, wherein the polyimide resin component (A) is incorporated with at least one kind of polyimide resin having a glass transition temperature above or equal to 180°C. The above composition imparts well balanced adhesiveness, heat resistance and resin flowability excellently to a thermosetting resin composition and a cured resin. COPYRIGHT: (C)2006,JPO&NCIPI
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