发明名称 |
Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus |
摘要 |
A scribing apparatus simultaneously performs scribing processes for a TFT substrate and a C/F substrate in the same location, thereby efficiently utilizing equipment space and achieving enhanced productivity. A substrate cutting apparatus is equipped with the scribing apparatus, and a substrate cutting method uses the substrate cutting apparatus. The scribing apparatus includes a stage for attracting a first mother substrate including first and second conjoined substrates, a scribing belt for holding a second mother substrate including conjoined third and fourth substrates, and a head unit for forming cracks in the second substrate of the first mother substrate or in the third substrate of the second mother substrate.
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申请公布号 |
US2006097022(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
US20050169857 |
申请日期 |
2005.06.30 |
申请人 |
LG. PHILIPS LCD CO., LTD. |
发明人 |
KIM JUNG S. |
分类号 |
B26F3/00;B23K26/067;B23K26/08;B23K26/40;B28D5/00;C03B33/07;C03B33/09;G02F1/1333 |
主分类号 |
B26F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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