| 发明名称 |
ULTRASONIC AGITATION OF SOLDER DURING REFLOW |
| 摘要 |
<p>A solder bump 104 is formed by providing solder material on a conductive site 102 of a substrate 100. The solder material is reflowed to provide a solder bump on the substrate. The solder material is ultrasonically agitated during at least a part of the reflow to at least partially mitigate formation of voids in the solder bump.</p> |
| 申请公布号 |
WO2006049874(A1) |
申请公布日期 |
2006.05.11 |
| 申请号 |
WO2005US37551 |
申请日期 |
2005.10.19 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED;BAYOT, ART;VALERIO, RICHARD |
发明人 |
BAYOT, ART;VALERIO, RICHARD |
| 分类号 |
(IPC1-7):B23K1/06;B23K5/20;B23K31/00;B23K31/02;B23K20/10 |
主分类号 |
(IPC1-7):B23K1/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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