发明名称 ELECTRONIC COMPONENT CONVEYOR AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component conveyor for a carrier tape, a tray or the like which is made of a resin and keeps front and back faces flat, and its manufacturing method. SOLUTION: The manufacturing method is equipped with a pressing process wherein a multilayered structural body consisting of a surface layer made of a resin material with no air bubble and a foamed resin material of a lower layer below this surface layer is used, and the multilayered structural body is pressed from its surface layer side to the air bubble layer by a projected punch mold corresponding to a size and a shape of a required electronic component, to punch the surface layer and to compress the air bubble layer, and by absorbing thereby a volume required for storing the electronic component into this air bubble layer region, while a condition that the thickness is approximately the same and the front and back faces are flat is kept, a storing part with a closed-end and a recessed shape for storing the electronic component is formed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006117250(A) 申请公布日期 2006.05.11
申请号 JP20040303825 申请日期 2004.10.19
申请人 INTERNATIONAL CHEMICAL:KK 发明人 SUO MASAAKI
分类号 B65D85/86;B29C43/02;B29K67/00;B29K69/00;B29L7/00;B65B15/04;B65B47/04;B65D65/40;B65D73/02 主分类号 B65D85/86
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