发明名称 HERMETIC SEALING PACKAGE AND METHOD OF MANUFACTURING DEVICE USING SAME
摘要 PROBLEM TO BE SOLVED: To solve the problem that poor bonding partially occurs, since a gap is made in a part between a metal film and a brazing material due to curvature of a ceramic container or nonuniformity of its shape, in a conventional structure in which the metal film is formed on the surface of a welded part of the ceramic container, the brazing material is provided on a surface of a lid, and seam welding is performed. SOLUTION: In an upper surface of a side wall part 7 of a ceramic base body 6, a metallized layer 8 is provided on a part facing a lid 10 and a brazing material 9 which is annular and continuous is formed over the metallized layer 8. A first metal layer 11 is provided on a surface which faces at least the ceramic base body 6 of the lid 10. The ceramic base body 6 and the lid 10 are arranged to face each other and are sealed by melting the brazing material 9. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006121118(A) 申请公布日期 2006.05.11
申请号 JP20060020285 申请日期 2006.01.30
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUO SATOSHI
分类号 H01L23/02 主分类号 H01L23/02
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