| 摘要 |
PROBLEM TO BE SOLVED: To improve the inferiority in non-sticking properties of a soldering paste at the central part of a mask by holding down the warping of the mask to the minimum. SOLUTION: The printing method of an electrically conductive ink, in which the printing mask is arranged on a wafer and the electrically conductive ink is printed on the wafer by moving a squeegee and finally the printing mask and the electrically conductive ink are separated from each other by moving a stage up and down, comprises a process for printing the electrically conductive ink in the opening parts of the printing mask arranged on the wafer after the fixation of the printing mask on the wafer, a process for fixing the printing mask locating above the peripheral part of the stage with supporting members and a process for separating the printing mask and the wafer from each other under the condition that gaseous pressure is applied from the upper side of the printing mask. COPYRIGHT: (C)2006,JPO&NCIPI
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