发明名称 |
Low dielectric constant compositions and methods of use thereof |
摘要 |
Low dielectric compositions and methods of use thereof in integrated circuits are disclosed. The low dielectric compositions are derived from carbosilane polymers and oligomers containing imbedded sila- or disilacyclobutane rings and, after heating to induce cross-linking, may be used as an interlayer dielectric as well as a capping layer within an integrated circuit.
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申请公布号 |
US2006099819(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
US20050219211 |
申请日期 |
2005.09.02 |
申请人 |
RENSSELAER POLYTECHNIC INSTITUTE |
发明人 |
INTERRANTE LEONARD V.;WU ZHIZHONG;WANG PEI-I;LU TOH-MING |
分类号 |
H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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