发明名称 |
Apparatus for depositing thin film on wafer |
摘要 |
A thin film deposition apparatus that can effectively use a chemical source having a high vaporization temperature is provided. The thin film deposition apparatus includes a chamber for depositing a thin film on a wafer, a canister for accommodating a liquid chemical source to be supplied to the chamber, and a vaporizer for vaporizing the liquid chemical source bubbled in the canister and providing the vaporized chemical source to the chamber. The vaporizer is installed on a top surface or lateral surface of the chamber by an adaptor block to be incorporated into the chamber. A first gas line between the vaporizer and the chamber is formed within the adaptor block.
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申请公布号 |
US2006096534(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
US20050264993 |
申请日期 |
2005.11.02 |
申请人 |
LIM HONG J;LEE SAHNG K;SEO TAE W;CHANG HO S |
发明人 |
LIM HONG J.;LEE SAHNG K.;SEO TAE W.;CHANG HO S. |
分类号 |
C23C16/00 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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