| 摘要 |
An apparatus and method for monitoring pressure within an adhesion promotion unit is provided. The apparatus in one embodiment includes a chamber configured to receive and heat a semiconductor wafer. A vacuum device is in fluid communication with a processing space within the chamber, wherein the vacuum device is configured to create a vacuum within the processing space. A vacuum monitor is also in fluid communication with the processing space, wherein the vacuum monitor generates a first electrical signal if gas pressure within the processing space is below a predetermined value. The apparatus may further include a processor in data communication with the vacuum monitor and the vacuum device. The vacuum device may generate a second electrical signal, and the processor generates a third electrical signal if the vacuum monitor fails to generate the first electrical signal within a predetermined amount of time after the vacuum device generates the second signal.
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