| 摘要 |
Microelectronic packages include a microelectronic element and portions of a lead frame disposed beneath the microelectronic element. The lead frame may be laminated with a dielectric element and the resulting laminate may be punched to remove the bus bar included in the lead frame, thereby forming an in-process unit having the leads and terminals of the original lead frame attached to the dielectric element. A microelectronic element such as a semiconductor chip may be assembled with such an in-process element and, desirably, encapsulated to form a package. |
