| 摘要 |
To provide a heat resistant cushioning material for press molding for use in the manufacture of the laminates for printed wiring boards, printed wiring boards, CSPs, and flat panel displays, of which cushion volume can be increased without changing its rate of temperature rise thereby allowing uniform heat distribution. The above object is achieved by a heat resistant cushioning material for press molding, which is formed by laminating one or more layers of batt fiber onto one side or both sides of a base fabric and integrating said batt fiber and said base fabric by needling, said batt fiber consisting of one or more kinds of fibers being the same as or different from those used for the base fabric, wherein said cushioning material comprises such heat conductive fibers that a product formed of the heat conductive fibers and configured to have an area weight of 4000 g/m<2> has a rate of temperature rise of not smaller than 3.6 DEG c/min in a range of 90 DEG c to 140 DEG c. <IMAGE> |
