| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent excessive stress application and crack occurrence due to mismatching of thermal expansion. <P>SOLUTION: A first ferrule 103 is connected to an optical waveguide chip 101 to fix to insert an optical fiber 102. A package 104 incorporates the optical waveguide chip 101 and the first ferrule 103 to provide an opening 104a for passing the optical fiber 102 to the outside on a side wall. A pipe 105 is airtightly fixed around the opening 104a. A second ferrule 106 is inserted in the pipe 105 to be airtightly fixed on the edge of the pipe 105, and fixed to insert the optical fiber 102 going to the outside of the package 104 through the opening 104a. The optical fiber 102 having no deflection is stored in the package 104, by matching a first extension amount generated due to the thermal expansion of the package 104 and the thermal expansion of the pipe 105 with a second extension amount generated due to the thermal expansion of the optical fiber 102 and the thermal expansion of the second ferrule 106. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
