| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of through-wiring for a substrate capable of surely forming the wiring extending from one surface of the substrate to the other surface thereof in a through-hole. SOLUTION: A first resin layer 27 and a metal layer 40 are laminated and formed in this order on a semiconductor substrate 24. A first through-hole 44 is formed in the metal layer 40, and a second through-hole 45 and a non-through-hole 46 are formed to be in communication with the first through-hole 44 in the first resin layer 27 and the semiconductor substrate 24, respectively. When an electrically conductive resin material 62 is supplied to the first through-hole 44, the conductive resin material 62 does not extend over the surface of the metal layer 40 because the contact angle is large between the metal layer 40 and the conductive resin material 62, so that the first through-hole 44 can surely be blocked and the conductive resin material 62 can surely be injected into the non-through-hole 46 utilizing pressure difference. The through-wiring 21 is formed by curing the conductive resin material 62 and removing a part of the semiconductor substrate 24 from the other surface 36 side. COPYRIGHT: (C)2006,JPO&NCIPI
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