发明名称 PHOTO-SENSITIVE RESIN COMPOSITION FOR FORMING ADHESIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a photo-sensitive resin composition showing adhesion specifically to a polyester. SOLUTION: The photo-sensitive resin composition for forming an adhesive material comprises a resin (a) having a number average molecular weight of 1,000-500,000 and an organic compound (b) containing a polymerizable unsaturated group and having a number average molecular weight of 100- less than 1,000, and the resin (a) contains a compound containing a carbonate bond and a urethane bond in the main chain in an amount of 20-100 wt% relative to the total amount of the resin (a), and the composition can be cured by light. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006117858(A) 申请公布日期 2006.05.11
申请号 JP20040309156 申请日期 2004.10.25
申请人 ASAHI KASEI CHEMICALS CORP 发明人 YAMADA HIROSHI;TOMEBA HIROSHI
分类号 C09J175/04;B32B7/12;B32B27/36;C09J4/00;C09J5/00;C09J7/02;C09J175/14 主分类号 C09J175/04
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