| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic bonding structure with improved mechanical bonding strength focusing attention on a composition in a boundary region formed by ultrasonic bonding. SOLUTION: An electronic component comprises a conductor layer including a pad electrode 5 formed of aluminum or an aluminum alloy, and a bump electrode 12 formed of gold or a gold alloy which is ultrasonic-bonded to the pad electrode 5 with the conductor layer and the bump electrode 12 being formed on a piezoelectric substrate 1. At least in part of a bonding interface region 15 formed by bonding the pad electrode 5 and the bump electrode 12, distribution regions formed of high melting point metal compounds are scattered. In an area surrounding the bonding interface region 15, top faces of the piezoelectric substrate 1 and the conductor layer are covered by a protective layer formed of the high melting point metal compound. COPYRIGHT: (C)2006,JPO&NCIPI
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