| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost printed circuit board, having versatility whose peeling strength from the base material of a pad is high, with regard to the printed circuit board with a pad formed on an insulating base material via an adhesive layer. SOLUTION: A hole 23 is provided on the base material 21 on which a pad 27 is formed. The pad 27 consists of a flange 27a formed at the periphery of the opening of the hole 23 on the base material 21, and a hole 27b which is connected to the flange 27a formed along the wall surface of the hole 23. COPYRIGHT: (C)2006,JPO&NCIPI
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