| 发明名称 |
No-flow underfill materials for flip chips |
| 摘要 |
Systems and methods are described which include packaging semiconductor dies and next level packages using low viscosity no-flow underfills having fine fillers treated with surface treatment agents.
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| 申请公布号 |
US2006097403(A1) |
申请公布日期 |
2006.05.11 |
| 申请号 |
US20040985428 |
申请日期 |
2004.11.10 |
| 申请人 |
LEBONHEUR VASSOUDEVANE;CASKEY TERRENCE C |
发明人 |
LEBONHEUR VASSOUDEVANE;CASKEY TERRENCE C. |
| 分类号 |
H01L21/48;H01L21/44;H01L21/50;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/48 |
| 代理机构 |
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