发明名称 |
Methods of conducting wafer level burn-in of electronic devices |
摘要 |
Methods of conducting wafer level burn-in (WLBI) of semiconductor devices are presented wherein systems are provided having at least two electrodes ( 210, 215 ). Electrical bias ( 920 ) and/or thermal power ( 925 ) is applied on each side of a wafer ( 100 ) having back and front electrical contacts for semiconductor devices borne by the wafer. A pliable conductive layer ( 910 ) is described for supplying pins on the device side of a wafer with electrical contact and/or also for providing protection to the wafer from mechanical pressure being applied to its surfaces. Use of a cooling system ( 950 ) is also described for enabling the application of a uniform temperature to a wafer undergoing burn-in. Wafer level burn-in is performed by applying electrical and physical contact ( 915 ) using an upper contact plate to individual contacts for the semiconductor devices; applying electrical and physical contact using a lower contact plate ( 910 ) to a substrate surface of said semiconductor wafer; providing electrical power ( 920 ) to said semiconductor devices through said upper and lower second contact plates from a power source coupled to said upper and lower contacts plates; monitoring and controlling electrical power ( 935 ) to said semiconductor devices for a period in accordance with a specified burn-in criteria; removing electrical power at completion of said period ( 955 ); and removing electrical and physical contact to said semiconductor wafer ( 965 ).
|
申请公布号 |
US2006097337(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
US20050486661 |
申请日期 |
2005.04.22 |
申请人 |
HAJI-SHEIKH MICHAEL J;BIARD JAMES R;RABINOVICH SIMON;GUENTER JAMES K;HAWKINS BOBBY M |
发明人 |
HAJI-SHEIKH MICHAEL J.;BIARD JAMES R.;RABINOVICH SIMON;GUENTER JAMES K.;HAWKINS BOBBY M. |
分类号 |
H01L31/06 |
主分类号 |
H01L31/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|