发明名称 Staggered wirebonding configuration
摘要 The present invention discloses a staggered finger configuration comprising a plurality of first and second conducting wires alternately arranged on the substrate, wherein each of the first conducting wire connecting an inner and an outer fingers and each of the second conducting wire connecting an intermediate finger between the inner and the outer fingers, thereby forming a staggered configuration.
申请公布号 US2006097387(A1) 申请公布日期 2006.05.11
申请号 US20050265085 申请日期 2005.11.03
申请人 ADVANCED SEMICONDUCTOR ENGINEERING, INC. 发明人 DING YI-CHUAN
分类号 H01L23/34;H01L21/56;H01L21/607;H01L23/04;H01L23/485;H01L23/498 主分类号 H01L23/34
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