| 摘要 |
<p>A pad structure for a semiconductor package is provided by forming solder lands at predetermined locations on a printed circuit board. First circular pad portions are formed protruding laterally from upper surfaces of the solder lands. Second circular pad portions are formed protruding laterally from other lateral sides of the pads. The leads are secured to the pads of the semiconductor package so that, when the first and second circular pad portions are pushed laterally, the circular pad portions do not contact each other, thereby preventing short circuits.</p> |
